The Hydra3D+ has a resolution of 832 x 600 pixel resolution and is aimed at 3D detection and measurement. It uses Teledyne e2v’s proprietary CMOS technology with a new 10 µm three-tap pixel which provides transfer times starting from 10ns.
The combination of the process technology and the pixel design also provides high sensitivity in the NIR wavelength with improved demodulation contrast. This enables the sensor to operate in real-time without motion artefacts, even with fast moving objects in the scene, and with excellent temporal noise at short ranges, essential in applications such as pick and place, logistics, factory automation and factory safety. Infrared Distance Sensor
An on-chip multi-system management feature enables the sensor to work alongside multiple active systems without interference which can lead to false measurements. This allows the ToF sensor to manage different levels of lighting and a wide range of reflectivity. The on-chip HDR includes on-the-fly flexible configuration, enables the best trade-off between application-level parameters such as distance range, object reflectivity and frame rate.
“Many Time-of-Flight sensors suffer from motion artefacts and can’t instantly perform in changing operating conditions. With Hydra3D+, our customers can easily achieve reliable 3D measurement with the highest levels of 3D performance, uncompromised image quality in both 2D and 3D modes, and in all distance ranges and conditions even where multiple systems operate or in outdoor environments,” said Ha Lan Do Thu, marketing manager for 3D imaging at Teledyne e2v.
Documentation, samples, and development tools are now available upon request. In addition, there are several proprietary modelling tools to support customers in their assessment of the operation of Hydra3D+.
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